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Introduction

Assembly and silicon processing is grouping all the process steps required for interconnecting a silicon chip to a substrate. The silicon chip can be processed as naked die or pre-assembled in a component package. Imec-Cmst offers the possibility to singulate the dies by wafer dicing, thin individual dies by mechanical grinding and bond the naked chips to a substrate using wire bonding or flip-chip. In case of packaged components, soldering of components can be performed using a soldering iron, IR solder station or vapor phase reflow.

Wafer bonder

Under construction

Die bonder

Under construction

Flip chip bonder

Under construction

Wire bonder

Under construction

Vapor phase reflow oven

Under construction

Infrared reflow oven

Under construction

Selective soldering and rework station

Under construction

Wafer grinder and polisher

Under construction

Wafer dicer

Under construction


e-poly : centre for advanced polymer based microsystems and applications
a Ghent University business unit
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